FALCON 5/C Reflow Solder/ Curing Oven
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Features
- Temperature Accuracy ± 2°C
- Temperature (Standard) Up to 400°C
- Maximum Substrate Size 5 in. x 5.75 in. (125 x 144 mm)
- Coolant Flow 0.5 to 2 GPM (2 to 8 liters/min.)
- O2 Level 10 PPM, 0.25 inch opening
Product Information
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MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP -
Details
Reflow
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Joyce Peng
- Tel : 03-5530377 ext.108
- Mail : Joyce_Peng@tkk.com.tw
